School of Integrated Circuit Science and Engineering-北京航空航天大学国际学院

Overview

Introduction of School of Integrated Circuit Science and Engineering

The School of Integrated Circuit Science and Engineering at Beihang University stands as a national-level talent cultivation base in integrated circuits domain. Anchored by the first-level discipline of “Integrated Circuit Science and Engineering,” it focuses on three key directions: Materials and Devices, Design and Tools, and Technology and Production. Comprising three departments aligned with these directions, the School has established a disciplinary system covering the entire IC industry chain.

The School is committed to building a dynamic and innovative faculty team. Over 80% of the faculty studied at top universities both in China and abroad, bringing a strong academic foundation. Meanwhile we have 5 national-level leading talents, 48 in-service doctoral supervisors, and 14 part-time doctoral supervisors, providing students with ample academic support.

The School's research focuses on emerging interdisciplinary directions, including advanced memory chips, aerospace chips, terahertz and radio-frequency chips, artificial intelligence chips, and advanced IC production. In the mean time，The School has established an innovative ecosystem integrating fundamental research, technological，and industrial transformation. It boasts over 3,000 square meters of intelligent research facilities and high-end production worth over 300 million yuan, including 3 state key laboratories, 8 provincial and ministerial-level scientific research platforms.

The School has pioneered China’s first 8-inch magnetic sensor wafer pilot line, developed the world’s largest-capacity third-generation magnetic storage chip, and cracked core technologies for high-end production such as magneto-optical Kerr microscopes and single-atomic-layer magnetron sputtering systems. In recent years, we have undertaken more than 200 projects, published over 20 papers in Nature and Science sub-journals and received 6 provincial/ministerial scientific awards, including the First Prize of Natural Science from the Chinese Institute of Electronics.

Majors

Integrated circuit science and engineering

Applicable discipline and Research orientation：

Aeropace chip design and automation; Post-Moore key processes and production; The RF chip and terahertz system，Integrated quantum sensing and intelligence

Electronic Science and Technology

Applicable discipline and Research orientation：

Space security intelligent chip system; Ultrafast optoelectronics and terahertz

Faculty

Name	Email	Discipline	Research Focus	Profile Link
赵巍胜 ZHAO Weisheng	wszhao@buaa.edu.cn	School of Integrated Circuit Science and Engineering	Spintronics、non-volatile memory	https://shi.buaa.edu.cn/09688/zh_CN/index.htm
成元庆 CHENG Yuanqing	yuanqing@buaa.edu.cn	School of Integrated Circuit Science and Engineering	3D IC Design Automation	www.cadetlab.cn
王鹏 WANG Peng	wang.peng@buaa.edu.cn	School of Integrated Circuit Science and Engineering	Uncertainty quantification、computational science、renewable energy & envrionment	https://shi.buaa.edu.cn/wangpeng1/zh_CN/index.htm
于海明 YU Haiming	haiming.yu@buaa.edu.cn	School of Integrated Circuit Science and Engineering	Magnonics	https://shi.buaa.edu.cn/hyu/zh_CN/index.htm
雷娜 LEI Na	na.lei@buaa.edu.cn	School of Integrated Circuit Science and Engineering	Spintronic materials and device	https://shi.buaa.edu.cn/leina/zh_CN/index.htm
曾琅 ZENG Lang	zenglang@buaa.edu.cn	School of Integrated Circuit Science and Engineering	Modeling and Simulation of Semiconductor and Spintronics Devices	https://shi.buaa.edu.cn/midfielder/zh_CN/index.htm
张悦 ZHANG Yue	yz@buaa.edu.cn	School of Integrated Circuit Science and Engineering	Spintronics、spin-based in-memory computing device、ultra-low power integrated circuit design、novel computing logic system	https://shi.buaa.edu.cn/yuezhang/zh_CN/index.htm
林晓阳 LIN Xiaoyang	XYLin@buaa.edu.cn	School of Integrated Circuit Science and Engineering	Integrated Circuits, Spintronics, Low-dimensional Electronics	https://shi.buaa.edu.cn/XYLin/en/index.htm
聂天晓 NIE Tianxiao	nietianxiao@buaa.edu.cn	School of Integrated Circuit Science and Engineering	Spintronic terahertz emission and manipulatio、magnetic random access memory	https://shi.buaa.edu.cn/nietianxiao/zh_CN/index.htm
温良恭 WEN Lianggong	wenlg@buaa.edu.cn	School of Integrated Circuit Science and Engineering	Terahertz Micro-nano Device、Advanced Mirco-nano Fabrication）	https://shi.buaa.edu.cn/wenlianggong/zh_CN/index/17515/list/index.htm
李奕晗 LI Yihan	yihanli@buaa.edu.cn	School of Integrated Circuit Science and Engineering	Integrated Photonics and IC Equipment Technology	https://shi.buaa.edu.cn/yihanli
康旺 KANG Wang	wkang@buaa.edu.cn	School of Integrated Circuit Science and Engineering	In memory computing	https://shi.buaa.edu.cn/kangwang/zh_CN/index/21199/list/
胡远奇 HU Yuanqi	YuanqiHu@buaa.edu.cn	School of Integrated Circuit Science and Engineering	Integrated Circuits Design	https://shi.buaa.edu.cn/yuanqihu86/en/index.htm
彭守仲 PENG Shouzhong	shouzhong.peng@buaa.edu.cn	School of Integrated Circuit Science and Engineering	Spintronics、microelectronic device	https://shi.buaa.edu.cn/shouzhong/zh_CN/index/27930/list/index.htm
朱大鹏 ZHU Dapeng	zhudp@buaa.edu.cn	School of Integrated Circuit Science and Engineering	Magnetic sensor chip based on tunneling magnetoresistance effect	https://shi.buaa.edu.cn/dlgdp5558/en/more/36638/jsjjgd/index.htm
潘彪 PAN Biao	panbiao@buaa.edu.cn	School of Integrated Circuit Science and Engineering	Digital Integrated Circuit Design；Artificial Intelligence Chip Design；Computing-in-memory Chip Design	https://shi.buaa.edu.cn/panbiao/zh_CN/index.htm
卢海昌 LU Haichang	haichanglu@buaa.edu.cn	School of Integrated Circuit Science and Engineering	First principle calculation	https://shi.buaa.edu.cn/luhaichang/zh_CN/index.htm
王新河 WANG Xinhe	xinhe@buaa.edu.cn	School of Integrated Circuit Science and Engineering	Integrated circuit (IC) equipment (process detection and equipment control) and emerging device circuits (spintronics and carbon-based electronics)	https://shi.buaa.edu.cn/wangxinhe/en/index.htm
史书园 SHI Shuyuan	smeshis@buaa.edu.cn	School of Integrated Circuit Science and Engineering	Spintronics	https://shi.buaa.edu.cn/shishuyuan/zh_CN/index.htm
杨光 YANG Guang	gy251@buaa.edu.cn	School of Integrated Circuit Science and Engineering	Superconducting spintroncis	https://shi.buaa.edu.cn/rightpalmprint/en/more/193351/jsjjgd/index.htm
刘晨晨 LIU Chenchen	chenchenliu@buaa.edu.cn	School of Integrated Circuit Science and Engineering	High Performance Computing for Artificial Intelligence,Processing-in-memory Computing Architecture and Chips, Heterogenous Computing	https://shi.buaa.edu.cn/liuchenchen/zh_CN/index.htm
方霄 FANG Xiao	xiao_fang@buaa.edu.cn	School of Integrated Circuit Science and Engineering	Millimeter wave/terahertz phased arrays, RF chips, on-chip/AiP antennas, low-power implantable chips, implantable/wearable human communications, embedded systems, etc.	https://shi.buaa.edu.cn/fangxiao/zh_CN/index.htm
张紫辰 ZHANG Zichen	zz241@buaa.edu.cn	School of Integrated Circuit Science and Engineering	Integrated Circuit Scienc	https://shi.buaa.edu.cn/zz241/zh_CN/index.htm
张慧 ZHANG Hui	zhang_hui@buaa.edu.cn	School of Integrated Circuit Science and Engineering	The research focuses on the design of high-speed mixed-signal circuits such as analog-to-digital converters (ADCs) and digital-to-analog converters (DACs), as well as the key technologies for communication chips, radar chips, and joint communication-sensing SoC design. In the field of high-speed ADCs and DACs, the main research goals are to enhance conversion speed, resolution, and energy efficiency, enabling AI-driven high-speed interconnects. Research on radar-communication chips centers on multi-band compatibility, high-linearity RF front ends, and low-phase-noise phase-locked loops (PLLs) to support large-scale MIMO systems and dynamic spectrum sharing.	http://www.sme.buaa.edu.cn/info/1008/3473.htm